JPH084742Y2 - 表面実装用電子部品及び絶縁性パッケージ - Google Patents
表面実装用電子部品及び絶縁性パッケージInfo
- Publication number
- JPH084742Y2 JPH084742Y2 JP7384389U JP7384389U JPH084742Y2 JP H084742 Y2 JPH084742 Y2 JP H084742Y2 JP 7384389 U JP7384389 U JP 7384389U JP 7384389 U JP7384389 U JP 7384389U JP H084742 Y2 JPH084742 Y2 JP H084742Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- hole
- insulating
- pin terminal
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7384389U JPH084742Y2 (ja) | 1989-06-22 | 1989-06-22 | 表面実装用電子部品及び絶縁性パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7384389U JPH084742Y2 (ja) | 1989-06-22 | 1989-06-22 | 表面実装用電子部品及び絶縁性パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0312525U JPH0312525U (en]) | 1991-02-07 |
| JPH084742Y2 true JPH084742Y2 (ja) | 1996-02-07 |
Family
ID=31613010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7384389U Expired - Lifetime JPH084742Y2 (ja) | 1989-06-22 | 1989-06-22 | 表面実装用電子部品及び絶縁性パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084742Y2 (en]) |
-
1989
- 1989-06-22 JP JP7384389U patent/JPH084742Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312525U (en]) | 1991-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |